Indium8.9 is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the Sn/Ag/Cu, Sn/Ag, and other alloy systems favored by the electronics industry to replace conventional Pb- bearing solders. Indium 8.9 offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. In addition, the high probe testability of Indium 8.9 minimizes false failures in ICT. TACFlux® 089HF is a no-clean flux formulated for Sn/Ag/Cu and Sn/Ag solders (also compatible with Sn/Pb solder). TACFlux® 089HF provides excellent wetting in air or nitrogen atmospheres. The flux and flux residue is halogen-free.